Description
SPEEDSTER SERIES
The Speedster series exemplifies a modern aerodynamic style though clean and elegant design. It is a thoughtful design with the sole purpose of maximizing airflow to improve cooling and performance.
AIRFLOW AND ASTHETICS
With each iteration of the XFX Merc series, we have simplified the design while improving performance. This newest iteration introduces our all new ridged backplate design which increases the overall surface area by 33% resulting in increased in heat dissipation when paired with thermal pads.
XFX GHOST THERMAL
Our new design features a stright through airflow venting to significatly improves cooling and compliments open design of the Ghost Thermal floating shroud design along with numerous other cooling features.
VAPOR CHAMBER
The XFX 7900 Series brings back the vapor chamber design, a more efficient method for heat dissipation than traditional cold plates alone. The vapor chamber can quickly quickly and efficiently transfer heat from the GPU and VRAM to the heat pipes, and then into the heatsink assembly.
XFX DUAL BIOS READY
We know enthusiast like options, so for our MERC Line of 7900 Series graphics cards we are offering dual BIOS . Giving a backup BIOS in the case of a failed BIOS update or flash.
EXTREME STABILITY AND OVERCLOCKING
A 10+3+1 phase power design implements a large V-Core allowing it to provide you with stable gameplay, and giving better power distribution across the VRMs.. This allows the GPU to operate cooler at baseline but also have tremendous room to overclock thanks to XFX’s increased power delivery BIOS.
BREAKTHROUGH PERFORMANCE
Breakthrough new levels of performance with 20GB of GDDR6 memory and blazing fast clock speeds to deliver an incredible experience at 4K and beyond. Radeon™ RX 7900 Series graphics feature advanced AMD RDNA™ 3 compute units, with 2nd generation raytracing accelerators and new AI accelerators to deliver incredible performance while maximizing graphical fidelity.
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